MASTERGAN1

High power density 600V half-bridge driver with two enhancement mode GaN HEMTs

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	VFQFPN 9X9X1.0 31L PITCH 0.6MM

Description

The MASTERGAN1 is an advanced power system-in-package integrating a gate driver and two enhancement mode GaN transistors in half‑bridge configuration.The integrated power GaNs have RDS(ON) of 150 mΩ and 650 V drain‑source breakdown voltage, while the high side of the embedded gate driver can...
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Key features

Key features
600 V system-in-package integrating half-bridge gate driver and high-voltage power GaN transistors: QFN 9 x 9 x 1 mm package R_DS(ON)= 150 mΩ I_DS(MAX) = 10 A Reverse current capability Zero reverse recovery loss UVLO protection on low-side and high-side Internal bootstrap diode Interlocking function Dedicated pin for shutdown functionality Accurate internal timing match 3.3 V to 15 V compatible inputs with hysteresis and pull-down Overtemperature protection Bill of material reduction Very compact and simplified layout Flexible, easy and fast design.

In stock

Quantity	$ per unit	Savings
1-9	$8.60	5%
10-24	$6.45	21%
25-99	$6.15	25%
100-249	$5.35	35%
250-499	$5.11	38%
500	$4.66	43%
500 +	Contact sales

$8.60

$8.17

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	VFQFPN 9X9X1.0 31L PITCH 0.6MM

Description

Key features

Key features
600 V system-in-package integrating half-bridge gate driver and high-voltage power GaN transistors: QFN 9 x 9 x 1 mm package R_DS(ON)= 150 mΩ I_DS(MAX) = 10 A Reverse current capability Zero reverse recovery loss UVLO protection on low-side and high-side Internal bootstrap diode Interlocking function Dedicated pin for shutdown functionality Accurate internal timing match 3.3 V to 15 V compatible inputs with hysteresis and pull-down Overtemperature protection Bill of material reduction Very compact and simplified layout Flexible, easy and fast design.