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    📢 Promotion ends on Mar. 31st! Get FREE SHIPPING for your automotive project! Order now! 🛒

    MASTERGAN1

    MASTERGAN1

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    MASTERGAN1TR

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    High power density 600V half-bridge driver with two enhancement mode GaN HEMTs
    Learn More about MASTERGAN1TR

    Quantity $ per Unit Savings
    1 - 9$14.980%
    10$12.8714%
    10 + Contact Sales
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    In stock
    $14.98
    Parameter NameParameter Value
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius125.0
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameVFQFPN 9X9X1.0 31L PITCH 0.6MM

    The MASTERGAN1 is an advanced power system-in-package integrating a gate driver and two enhancement mode GaN transistors in half‑bridge configuration.


    The integrated power GaNs have RDS(ON) of 150 mΩ and 650 V drain‑source breakdown voltage, while the high side of the embedded gate driver can be easily supplied by the integrated bootstrap diode.


    The MASTERGAN1 features UVLO protection on both the lower and upper driving sections, preventing the power switches from operating in low efficiency or dangerous conditions, and the interlocking function avoids cross-conduction conditions.


    The input pins extended range allows easy interfacing with microcontrollers, DSP units or Hall effect sensors.


    The MASTERGAN1 operates in the industrial temperature range, -40°C to 125°C.


    The device is available in a compact 9x9 mm QFN package.

    Key features
    • 600 V system-in-package integrating half-bridge gate driver and high-voltage power GaN transistors:
      • QFN 9 x 9 x 1 mm package
      • RDS(ON) = 150 mΩ
      • IDS(MAX) = 10 A
    • Reverse current capability
    • Zero reverse recovery loss
    • UVLO protection on low-side and high-side
    • Internal bootstrap diode
    • Interlocking function
    • Dedicated pin for shutdown functionality
    • Accurate internal timing match
    • 3.3 V to 15 V compatible inputs with hysteresis and pull-down
    • Overtemperature protection
    • Bill of material reduction
    • Very compact and simplified layout
    • Flexible, easy and fast design.