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MLPF-WB55-02E3

2.4 GHz Matched filter companion chip for STM32WB55Vx

ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF...
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Key features
  • Integrated impedance matching to STM32WB55Vx
  • LGA footprint compatible
  • 50 Ω nominal impedance on antenna side
  • Deep rejection harmonics filter
  • Low insertion loss
  • Small footprint
  • Low thickness ≤ 450 μm
  • High RF performance
  • RF BOM and area reduction
  • ECOPACK2 compliant component
In stock
Quantity $ per unit Savings
1-9$0.291%
10-99$0.279%
100-249$0.2513%
250-280$0.2225%
Contact sales
$0.29
$0.29
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameFLIP CHIP BUMPLESS CSPG

The MLPF-WB55-02E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55Vx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF...
Read More

Key features
  • Integrated impedance matching to STM32WB55Vx
  • LGA footprint compatible
  • 50 Ω nominal impedance on antenna side
  • Deep rejection harmonics filter
  • Low insertion loss
  • Small footprint
  • Low thickness ≤ 450 μm
  • High RF performance
  • RF BOM and area reduction
  • ECOPACK2 compliant component