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Wireless Connectivity
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- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
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- 105.0
- Ecopack2
- -40.0
- VFQFPN 48 6x6x0.9 mm
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Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
Active
MLPF-WB-01E3
In Stock
2.4 GHz Matched filter companion chip for STM32WB55Cx, STM32WB55Rx, STM32WB35xxx, STM32WB50xxx and S
- 105.0
- Ecopack2
- -40.0
- FLIP CHIP BUMPLESS CSPG
-
Active
ST60A2G0I1D7GYO
Out of Stock
60 GHz V-band contactless connectivity transceiver with SLVS or GPIO tunneling
- 105.0
- Ecopack2
- -40.0
- VFBGA 25 2.2X2.2X0.8 P 0.4 mm
-
Active
ST87M01-1100
Out of Stock
Ultra-compact, low-power narrowband (NB-IoT) industrial module series with GNSS capability
- 85.0
- Ecopack2
- -40.0
- SMD MODULE
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Active
BALF-SPI2-01D3
In Stock
50 Ω nominal input / conjugate match balun to S2-LP,868 - 930 MHz with integrated harmonic filt
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
