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    STM32F410C8U6

    STM32F410C8U6

    STM32F410C8U7TR

    STM32F410C8U7TR

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    STM32F410C8U7

    STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 64 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator

    Parameters
    Supply Voltage Min Volt1.7
    Supply Voltage Max Volt3.6
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius105.0
    CoreArm Cortex-M4
    ECCN US3A991.a.2
    ECCN EUNEC
    Packing TypeTray
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameUFQFPN 48 7x7x0.55 mm
    Description

    The STM32F410x8/B devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data...
    Read More

    Key features
    Key features
    • Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
      • 1.7 V to 3.6 V power supply
      • -40 °C to 85/105/125 °C temperature range
    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • Up to 128 Kbytes of Flash memory
      • 512 bytes of OTP memory
      • 32 Kbytes of SRAM
    • Clock, reset and supply management
      • 1.7 V to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • 4-to-26 MHz crystal oscillator
      • Internal 16 MHz factory-trimmed RC
      • 32 kHz oscillator for RTC with calibration
      • Internal 32 kHz RC with calibration
    • Power consumption
      • Run: 89 μA/MHz (peripheral off)
      • Stop (Flash in Stop mode, fast wakeup time): 40 μA Typ @ 25 °C; 49 μA max @25 °C
      • Stop (Flash in Deep power down mode, slow wakeup time): down to 6 μA @ 25 °C; 14 μA max @25 °C
      • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
      • VBAT supply for RTC: 1 μA @25 °C
    • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
    • 1×12-bit D/A converter
    • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
    • Up to 9 timers
      • One low-power timer (available in Stop mode)
      • One 16-bit advanced motor-control timer
      • Three 16-bit general purpose timers
      • One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • Two watchdog timers (independent window)
      • SysTick timer.
    • Debug mode
      • Serial wire debug (SWD) & JTAG interfaces
      • Cortex® -M4 Embedded Trace Macrocell™
    • Up to 50 I/O ports with interru
    Out of Stock
    Quantity $ per unit Savings
    1-9$4.680%
    10-99$4.2110%
    100-249$3.4526%
    250-499$3.2730%
    500-999$2.9437%
    1000-2499$2.4847%
    2500-10000$2.3550%
    10000 + Contact sales
    $4.68
    Parameters
    Supply Voltage Min Volt1.7
    Supply Voltage Max Volt3.6
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius105.0
    CoreArm Cortex-M4
    ECCN US3A991.a.2
    ECCN EUNEC
    Packing TypeTray
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameUFQFPN 48 7x7x0.55 mm
    Description

    The STM32F410x8/B devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data...
    Read More

    Key features
    Key features
    • Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode)
      • 1.7 V to 3.6 V power supply
      • -40 °C to 85/105/125 °C temperature range
    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • Up to 128 Kbytes of Flash memory
      • 512 bytes of OTP memory
      • 32 Kbytes of SRAM
    • Clock, reset and supply management
      • 1.7 V to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • 4-to-26 MHz crystal oscillator
      • Internal 16 MHz factory-trimmed RC
      • 32 kHz oscillator for RTC with calibration
      • Internal 32 kHz RC with calibration
    • Power consumption
      • Run: 89 μA/MHz (peripheral off)
      • Stop (Flash in Stop mode, fast wakeup time): 40 μA Typ @ 25 °C; 49 μA max @25 °C
      • Stop (Flash in Deep power down mode, slow wakeup time): down to 6 μA @ 25 °C; 14 μA max @25 °C
      • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
      • VBAT supply for RTC: 1 μA @25 °C
    • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
    • 1×12-bit D/A converter
    • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
    • Up to 9 timers
      • One low-power timer (available in Stop mode)
      • One 16-bit advanced motor-control timer
      • Three 16-bit general purpose timers
      • One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • Two watchdog timers (independent window)
      • SysTick timer.
    • Debug mode
      • Serial wire debug (SWD) & JTAG interfaces
      • Cortex® -M4 Embedded Trace Macrocell™
    • Up to 50 I/O ports with interru