STM32F411CCU6TR

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High-performance access line, Arm Cortex-M4 core with DSP and FPU, 256 Kbytes of Flash memory, 100 MHz CPU, ART Accelerator
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Quantity	$ per Unit	Savings
1 - 9	$8.12	0%
10 - 24	$7.35	9%
25 - 99	$7.01	14%
100 - 249	$6.09	25%
250 - 499	$5.81	28%
500	$5.30	35%
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Parameter

Parameter Name	Parameter Value
Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
ROHS Compliance Grade	Ecopack2
Grade	Industrial
Package Name	UFQFPN 48 7x7x0.55 mm

Description

The STM32F411xC/xE devices are based on the high-performance Arm^® Cortex^® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. The Cortex^®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.

The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.

The STM32F411xC/xE operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

These features make the STM32F411xC/xE microcontrollers suitable for a wide range of applications.

Key features

Key features
Dynamic Efficiency Line with BAM (Batch Acquisition Mode) 1.7 V to 3.6 V power supply - 40°C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 512 Kbytes of Flash memory 128 Kbytes of SRAM Clock, reset and supply management 1.7 V to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 100 μA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ @ 25C; 65 μA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): down to 9 μA @ 25 °C; 28 μA max @25 °C Standby: 1.8 μA @25 °C / 1.7 V without RTC; 11 μA @85 °C @1.7 V V_BAT supply for RTC: 1 μA @25 °C 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer Debug mode Serial wire debug (SWD) & JTAG interfaces Cortex^®-M4 Embedded Trace Macrocell™ Up to 81 I/O ports with interrupt capability Up to 78 fast I/Os up to 100 MHz Up to 77 5 V-tolerant I/Os Up to 13 communication interfaces Up to 3 x I²C interfaces (SMBus/PMBus)