STM32F412VGH6

STM32F412VGH6TR

Skip to the end of the images gallery

Skip to the beginning of the images gallery

Active

STM32F412VGT6

STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 1 Mbyte of Flash memory, 100 MHz CPU, Art Accelerator, DFSDM

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LQFP 100 14x14x1.4 mm

Description

STM32F412xE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It...
Read More

STM32F412xE/G devices are based on the high-performance Arm^® Cortex^® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex^®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.

STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.

They also feature standard and advanced communication interfaces:

- Up to four I²Cs, including one I²C supporting Fast-Mode Plus

- Five SPIs

- Five I²Ss of which two are full duplex. To achieve audio class accuracy, the I²S peripherals can be clocked via a dedicated internal audio PLL, or via an external clock to allow synchronization.

- Four USARTs

- An SDIO/MMC interface

- A USB 2.0 OTG full-speed interface

- Two CANs.

In addition, STM32F412xE/G devices embed advanced peripherals:

- A flexible static memory controller interface (FSMC)

- A Quad-SPI memory interface

- A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of microphone MEMs.

STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.

The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.

Key features

Key features
Includes ST state-of-the-art patented technology Dynamic efficiency line with BAM (Batch acquisition mode) Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1 Mbyte of flash memory 256 Kbytes of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 V to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 µA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 50 µA typical at 25 °C; 75 µA max at 25 °C Stop (flash memory in Deep power down mode, slow wakeup time): down to 18 µA at 25 °C; 40 µA max at 25 °C Standby: 2.4 µA at 25 °C / 1.7 V without RTC; 12 µA at 85 °C at 1.7 V V_BAT supply for RTC: 1 µA at 25 °C1×12-bit, 2.4 MSPS ADC: up to 16 channels 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support General-purpose DMA: 16-stream DMA Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer Debug mode Serial wire debug (SWD) and JTAG Cortex^Ò-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 17 communication interfaces Up to 4x I²C interfaces (SMBus/PMBus) Up to 4 USARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 2x CAN (2.0B Active) True random number generator CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK2 compliant

In stock

Quantity	$ per unit	Savings
1-9	$7.33	0%
10-24	$6.00	18%
25-49	$5.99	18%
50-99	$5.72	22%
100-539	$5.62	23%
540-10000	$5.61	24%
10000 +	Contact sales

$7.33