STM32F412ZET7TR

STM32F412ZET7TR

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STM32F412ZET6

STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 512 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator, DFSDM

Supply Voltage Min Volt1.7
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 144 20x20x1.4 mm

STM32F412xE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It...
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Key features
  • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
  • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 1 Mbyte of Flash memory
    • 256 Kbyte of SRAM
    • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
    • Dual mode Quad-SPI interface
  • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 112 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBAT supply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
  • General-purpose DMA: 16-stream DMA
  • Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer
  • Debug mode
    • Serial wire debug (SWD) & JTAG
    • Cortex®-M4 Embedded Trace Macrocell™
  • Up to 114 I/O ports with interrupt capability
    • Up to 109 fast I/Os up to 100 MHz
Out of Stock
Quantity $ per unit Savings
1-9$11.650%
10-24$10.5410%
25-99$10.0514%
100-249$8.7225%
250-359$8.3328%
360-1079$7.6035%
1080-10000$6.6243%
Contact sales
$11.65
Supply Voltage Min Volt1.7
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 144 20x20x1.4 mm

STM32F412xE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It...
Read More

Key features
  • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
  • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 1 Mbyte of Flash memory
    • 256 Kbyte of SRAM
    • Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory
    • Dual mode Quad-SPI interface
  • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 112 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C
    • Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBAT supply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support
  • General-purpose DMA: 16-stream DMA
  • Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer
  • Debug mode
    • Serial wire debug (SWD) & JTAG
    • Cortex®-M4 Embedded Trace Macrocell™
  • Up to 114 I/O ports with interrupt capability
    • Up to 109 fast I/Os up to 100 MHz
Associated products