STM32F413VGT3

High-performance access line, Arm Cortex-M4 core with DSP and FPU, 1 MByte of Flash memory, 100 MHz CPU, ART Accelerator, DFSDM

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LQFP 100 14x14x1.4 mm

Description

The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types....
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Key features

Key features
Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) 1.7 V to 3.6 V power supply -40 °C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1.5 Mbytes of Flash memory 320 Kbytes of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 μA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C VBAT supply for RTC: 1 μA @25 °C 2x12-bit D/A converters 1×12-bit, 2.4 MSPS ADC: up to 16 channels 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support General-purpose DMA: 16-stream DMA Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer Debug mode Serial wire debug (SWD) & JTAG Cortex^®-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 24 communication interfaces Up to 4x I²C interfaces (SMBus/PMBus) Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 3x CAN (2.0B Active) 1xSAI True random number generator CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK^®2

In stock

Quantity	$ per unit	Savings
1-9	$9.42	0%
10-49	$6.91	27%
50-539	$6.62	30%
540-10000	$6.61	30%
10000 +	Contact sales

$9.42

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LQFP 100 14x14x1.4 mm

Description

Key features

Key features
Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) 1.7 V to 3.6 V power supply -40 °C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1.5 Mbytes of Flash memory 320 Kbytes of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 μA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C VBAT supply for RTC: 1 μA @25 °C 2x12-bit D/A converters 1×12-bit, 2.4 MSPS ADC: up to 16 channels 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support General-purpose DMA: 16-stream DMA Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer Debug mode Serial wire debug (SWD) & JTAG Cortex^®-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 24 communication interfaces Up to 4x I²C interfaces (SMBus/PMBus) Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 3x CAN (2.0B Active) 1xSAI True random number generator CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK^®2