STM32F413ZGJ6TR

High-performance access line, Arm Cortex-M4 core with DSP and FPU, 1 MByte of Flash memory, 100 MHz CPU, ART Accelerator, DFSDM

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	UFBGA 144 10x10x0.6 P 0.8 mm

Description

The STM32F413xG/H devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types....
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Key features

Key features
Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) 1.7 V to 3.6 V power supply -40 °C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1.5 Mbytes of Flash memory 320 Kbytes of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 μA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C VBAT supply for RTC: 1 μA @25 °C 2x12-bit D/A converters 1×12-bit, 2.4 MSPS ADC: up to 16 channels 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support General-purpose DMA: 16-stream DMA Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer Debug mode Serial wire debug (SWD) & JTAG Cortex^®-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 24 communication interfaces Up to 4x I²C interfaces (SMBus/PMBus) Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 3x CAN (2.0B Active) 1xSAI True random number generator CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK^®2

Out of Stock

Quantity	$ per unit	Savings
1-9	$12.02	0%
10-24	$11.05	8%
25-99	$10.58	12%
100-249	$9.33	22%
250-499	$8.87	26%
500-999	$8.30	31%
1000-10000	$7.62	37%
10000 +	Contact sales

$12.01

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	UFBGA 144 10x10x0.6 P 0.8 mm

Description

Key features

Key features
Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) 1.7 V to 3.6 V power supply -40 °C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1.5 Mbytes of Flash memory 320 Kbytes of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 μA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 μA Typ.; 80 μA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): 15 μA Typ.; 46 μA max @25 °C Standby without RTC: 1.1 μA Typ.; 14.7 μA max at @85 °C VBAT supply for RTC: 1 μA @25 °C 2x12-bit D/A converters 1×12-bit, 2.4 MSPS ADC: up to 16 channels 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support General-purpose DMA: 16-stream DMA Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer Debug mode Serial wire debug (SWD) & JTAG Cortex^®-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 24 communication interfaces Up to 4x I²C interfaces (SMBus/PMBus) Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 3x CAN (2.0B Active) 1xSAI True random number generator CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK^®2