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STM32WB55VEY7TR

STM32WB55VEY7TR

STM32WB55VEQ7

STM32WB55VEQ7

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STM32WB55VEY6TR

Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32 MHz with 512 Kbytes of Flash memory, Bluetooth LE 5.3, 802.15.4, Zigbee, Thread, Matter, USB, LCD, AES-256

Supply Voltage Min Volt1.71
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
Operating Voltage Min Volt1.71
Operating Voltage Max Volt3.6
CoreArm Cortex-M4
ECCN US5A992.c
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameWLCSP 100 4.4x4.4x0.6 P 0.4 mm

The STM32WB55xx and STM32WB35xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification 5.2 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex®-M0+ for performing all the real-time low...
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Key features
  • Include ST state-of-the-art patented technology
  • Radio
    • 2.4 GHz
    • RF transceiver supporting Bluetooth® 5.2 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and Zigbee® 3.0
    • RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
    • Programmable output power up to +6 dBm with 1 dB steps
    • Integrated balun to reduce BOM
    • Support for 2 Mbps
    • Dedicated Arm® 32-bit Cortex® M0+ CPU for real-time Radio layer
    • Accurate RSSI to enable power control
    • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
    • Support for external PA
    • Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB-01E3 or MLPF-WB-02E3)
  • Ultra-low-power platform
    • 1.71 to 3.6 V power supply
    • – 40 °C to 85 / 105 °C temperature ranges
    • 13 nA shutdown mode
    • 600 nA Standby mode + RTC + 32 KB RAM
    • 2.1 µA Stop mode + RTC + 256 KB RAM
    • Active-mode MCU: < 53 µA / MHz when RF and SMPS on
    • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
  • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
  • Performance benchmark
    • 1.25 DMIPS/MHz (Drystone 2.1)
    • 219.48 CoreMark® (3.43 CoreMark/MHz at 64 MHz)
  • Energy benckmark
    • 303 ULPMark™ CP score
  • Supply and reset management
    • High efficiency embedded SMPS step-down converter with intelligent bypass mode
    • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
    • Ultra-low-power POR/PDR
    • Programmable voltage d
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$8.01
Supply Voltage Min Volt1.71
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
Operating Voltage Min Volt1.71
Operating Voltage Max Volt3.6
CoreArm Cortex-M4
ECCN US5A992.c
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameWLCSP 100 4.4x4.4x0.6 P 0.4 mm

The STM32WB55xx and STM32WB35xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification 5.2 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex®-M0+ for performing all the real-time low...
Read More

Key features
  • Include ST state-of-the-art patented technology
  • Radio
    • 2.4 GHz
    • RF transceiver supporting Bluetooth® 5.2 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and Zigbee® 3.0
    • RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
    • Programmable output power up to +6 dBm with 1 dB steps
    • Integrated balun to reduce BOM
    • Support for 2 Mbps
    • Dedicated Arm® 32-bit Cortex® M0+ CPU for real-time Radio layer
    • Accurate RSSI to enable power control
    • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
    • Support for external PA
    • Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB-01E3 or MLPF-WB-02E3)
  • Ultra-low-power platform
    • 1.71 to 3.6 V power supply
    • – 40 °C to 85 / 105 °C temperature ranges
    • 13 nA shutdown mode
    • 600 nA Standby mode + RTC + 32 KB RAM
    • 2.1 µA Stop mode + RTC + 256 KB RAM
    • Active-mode MCU: < 53 µA / MHz when RF and SMPS on
    • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
  • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
  • Performance benchmark
    • 1.25 DMIPS/MHz (Drystone 2.1)
    • 219.48 CoreMark® (3.43 CoreMark/MHz at 64 MHz)
  • Energy benckmark
    • 303 ULPMark™ CP score
  • Supply and reset management
    • High efficiency embedded SMPS step-down converter with intelligent bypass mode
    • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
    • Ultra-low-power POR/PDR
    • Programmable voltage d