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600V three-phase controller with MCU

Quantity $ per Unit Savings
1 - 9$6.140%
10 - 20$5.668%
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Parameter NameParameter Value
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius125.0
ECCN US3A991.a.2
Packing TypeTray
RoHs compliantEcopack2
Package NameTQFP 64 10x10x1.0

The STSPIN32F060x system-in-package is an extremely integrated solution for driving three-phase applications, helping designers to reduce PCB area and overall bill-of-material.

It embeds an STM32F031x6x7 featuring an ARM® 32-bit Cortex®-M0 CPU and a 600 V triple half-bridge gate driver, able to drive N-channel power MOSFETs or IGBTs.

A comparator featuring advanced smartSD function is integrated, ensuring fast and effective protection against overload and overcurrent.

The high-voltage bootstrap diodes are also integrated, as well as anti cross-conduction, deadtime and UVLO protection on both the lower and upper driving sections, which prevents the power switches from operating in low efficiency or dangerous conditions. Matched delays between low and high-side sections guarantee no cycle distortion.

The integrated MCU allows performing FOC, 6-step sensorless and other advanced driving algorithms including the speed control loop.

Key features
  • Three-phase gate drivers
    • High voltage rail up to 600 V
    • dV/dt transient immunity ±50 V/ns
    • Gate driving voltage range from 9V to 20V
  • Driver current capability:
    • STSPIN32F0601/Q: 200/350 mA source/sink current
    • STSPIN32F0602/Q: 1/0.85 A source/sink current
  • 32-bit ARM® Cortex®-M0 core:
    • Up to 48 MHz clock frequency
    • 4-kByte SRAM with HW parity
    • 32-kByte Flash memory with option bytes
    • used for write/readout protection
  • 21 general-purpose I/O ports (GPIO)
  • 6 general-purpose timers
  • 12-bit ADC converter (up to 10 channels)
  • I2C, USART and SPI interfaces
  • Matched propagation delay for all channels
  • Integrated bootstrap diodes
  • Comparator for fast over current protection
  • UVLO, Interlocking and deadtime functions
  • Smart shutdown (smartSD) function
  • Standby mode for low power consumption
  • On-chip debug support via SWD
  • Extended temperature range: -40 to +125 °C
  • Package:
    • TQFP 10x10 64L pitch 0.5 Creepage 1.2 mm
    • QFN 10x10 72L pitch 0.5 Creepage 1.8 mm