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    STSPIN32F0602

    STSPIN32F0602

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    STSPIN32F0602TR

    600V three-phase controller with MCU

    Parameters
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius125.0
    ECCN US3A991.a.2
    ECCN EUNEC
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameTQFP-EP 64 10x10x1.0 mm
    Description

    The STSPIN32F060x system-in-package is an extremely integrated solution for driving three-phase applications, helping designers to reduce PCB area and overall bill-of-material.It embeds an STM32F031x6x7 featuring an ARM® 32-bit Cortex®-M0 CPU and a 600 V triple half-bridge gate driver, able to...
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    Key features
    Key features
    • Three-phase gate drivers
      • High voltage rail up to 600 V
      • dV/dt transient immunity ±50 V/ns
      • Gate driving voltage range from 9V to 20V
    • Driver current capability:
      • STSPIN32F0601/Q: 200/350 mA source/sink current
      • STSPIN32F0602/Q: 1/0.85 A source/sink current
    • 32-bit ARM® Cortex®-M0 core:
      • Up to 48 MHz clock frequency
      • 4-kByte SRAM with HW parity
      • 32-kByte Flash memory with option bytes
      • used for write/readout protection
    • 21 general-purpose I/O ports (GPIO)
    • 6 general-purpose timers
    • 12-bit ADC converter (up to 10 channels)
    • I2C, USART and SPI interfaces
    • Matched propagation delay for all channels
    • Integrated bootstrap diodes
    • Comparator for fast over current protection
    • UVLO, Interlocking and deadtime functions
    • Smart shutdown (smartSD) function
    • Standby mode for low power consumption
    • On-chip debug support via SWD
    • Extended temperature range: -40 to +125 °C
    • Package:
      • TQFP 10x10 64L pitch 0.5 Creepage 1.2 mm
      • QFN 10x10 72L pitch 0.5 Creepage 1.8 mm
    Out of Stock
    Parameters
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius125.0
    ECCN US3A991.a.2
    ECCN EUNEC
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameTQFP-EP 64 10x10x1.0 mm
    Description

    The STSPIN32F060x system-in-package is an extremely integrated solution for driving three-phase applications, helping designers to reduce PCB area and overall bill-of-material.It embeds an STM32F031x6x7 featuring an ARM® 32-bit Cortex®-M0 CPU and a 600 V triple half-bridge gate driver, able to...
    Read More

    Key features
    Key features
    • Three-phase gate drivers
      • High voltage rail up to 600 V
      • dV/dt transient immunity ±50 V/ns
      • Gate driving voltage range from 9V to 20V
    • Driver current capability:
      • STSPIN32F0601/Q: 200/350 mA source/sink current
      • STSPIN32F0602/Q: 1/0.85 A source/sink current
    • 32-bit ARM® Cortex®-M0 core:
      • Up to 48 MHz clock frequency
      • 4-kByte SRAM with HW parity
      • 32-kByte Flash memory with option bytes
      • used for write/readout protection
    • 21 general-purpose I/O ports (GPIO)
    • 6 general-purpose timers
    • 12-bit ADC converter (up to 10 channels)
    • I2C, USART and SPI interfaces
    • Matched propagation delay for all channels
    • Integrated bootstrap diodes
    • Comparator for fast over current protection
    • UVLO, Interlocking and deadtime functions
    • Smart shutdown (smartSD) function
    • Standby mode for low power consumption
    • On-chip debug support via SWD
    • Extended temperature range: -40 to +125 °C
    • Package:
      • TQFP 10x10 64L pitch 0.5 Creepage 1.2 mm
      • QFN 10x10 72L pitch 0.5 Creepage 1.8 mm
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