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VD55G1CCB0/RW

Tiny, smart, low power, 800 x 700, monochrome global shutter image sensor

Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape Mounted
RoHs compliantN/A
GradeIndustrial
Package NameDIE

The VD55G1 is a unique ultracompact and low-power image sensor in the ST BrightSense portfolio. It has been developed to enable the next generation of smart and power-efficient systems. Leveraging the world’s first 2.16 µm global shutter pixel, the sensor highlights maximum compactness. It has a...
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Key features
  • Tiny sensor, which can fit everywhere:
    • World’s first 2.16 µm global shutter pixel for optimum compactness
    • Footprint of only 2.73 x 2.16 mm²
    • Small optical format of 1/9 inch (800 x 700) and 1/10 inch (600 x 600)
  • Ultralow power solution with:
    • Smart auto wake-up feature, with ultralow power sleepy mode, and smart wake up when an event is detected
    • Low power operation of ≤ 2 mW in auto wake-up mode
    • Power consumption scaling with features, frame rate, and software standby
  • Optimized image quality straight out of the sensor with:
    • Cutting-edge performance of ST proprietary pixels combining global shutter, BSI, CDTI, and 3D stacking
    • High sensitivity and sharpness in both visible and NIR
    • Various on-chip features to optimize image quality, such as autoexposure, noise reduction, or defect correction
  • Seamless integration into embedded systems:
    • 1-lane MIPI CSI-2 output
    • I²C and I3C control interface
    • Effortless integration with VD55G1 development kit, camera modules, with drivers available from st.com
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Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape Mounted
RoHs compliantN/A
GradeIndustrial
Package NameDIE

The VD55G1 is a unique ultracompact and low-power image sensor in the ST BrightSense portfolio. It has been developed to enable the next generation of smart and power-efficient systems. Leveraging the world’s first 2.16 µm global shutter pixel, the sensor highlights maximum compactness. It has a...
Read More

Key features
  • Tiny sensor, which can fit everywhere:
    • World’s first 2.16 µm global shutter pixel for optimum compactness
    • Footprint of only 2.73 x 2.16 mm²
    • Small optical format of 1/9 inch (800 x 700) and 1/10 inch (600 x 600)
  • Ultralow power solution with:
    • Smart auto wake-up feature, with ultralow power sleepy mode, and smart wake up when an event is detected
    • Low power operation of ≤ 2 mW in auto wake-up mode
    • Power consumption scaling with features, frame rate, and software standby
  • Optimized image quality straight out of the sensor with:
    • Cutting-edge performance of ST proprietary pixels combining global shutter, BSI, CDTI, and 3D stacking
    • High sensitivity and sharpness in both visible and NIR
    • Various on-chip features to optimize image quality, such as autoexposure, noise reduction, or defect correction
  • Seamless integration into embedded systems:
    • 1-lane MIPI CSI-2 output
    • I²C and I3C control interface
    • Effortless integration with VD55G1 development kit, camera modules, with drivers available from st.com