Wireless and Contactless Sub-System
-
- 125.0
- Ecopack2
- -40.0
- DFN4 1x1
-
Active
STM32MP157CAD3
Out of Stock
MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displ
- 125.0
- Ecopack2
- -40.0
- TFBGA 257 10x10x1.2 P 0.5 mm
-
- 85.0
- Ecopack2
- -40.0
- VFQFPN 48 6x6x0.9 mm
-
Active
BALF-SPI2-02D3
In Stock
50 Ω nominal input / conjugate match balun to S2-LP, 433 - 470 MHz with integrated harmonic fil
- 105.0
- Ecopack2
- 40.0
- Chip Scale Package 0.4mm pitch
-
- 85.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
-
Active
STSAFA110S8SPL02
In Stock
Authentication, state-of-the-art security for peripherals and IoT devices
- N/A
- SO-8
- 1.8
- 5.5
-
Active
BLUENRG-M2SA
Out of Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, CHIP ANT
-
Active
STSAFA110DFSPL02
In Stock
Authentication, state-of-the-art security for peripherals and IoT devices
- N/A
- UFDFPN 8 2x3x0.6
- 1.8
- 5.5
-
Active
STM32MP157CAB3
In Stock
MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displ
- 125.0
- Ecopack2
- -40.0
- LFBGA 354 16x16x1.7 P 0.8 mm
-
Active
ST25TV02KC-TFH9
Out of Stock
NFC Type 5 / RFID tag IC with EEPROM with 2.5-Kbit, product identification and protection
- 85.0
- Ecopack2
- -40.0
- UFDFPN5
