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IMP23ABSUTR

Analog Bottom MEMS microphone for ultrasound applications

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameRHLGA 2.65X3.5X1.08(MAX)MM 4L

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.The IMP23ABSU has an acoustic overload...
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Key features
  • Single supply voltage operation 1.52 V - 3.6 V
  • Omnidirectional sensitivity
  • High signal-to-noise ratio
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering
  • Enhanced RF immunity
  • Ultra-flat frequency response
  • Ultrasound bandwidth (up to 80 kHz)
  • Low latency
  • Ultra-low-power: 150 µA max.
  • ECOPACK, RoHS, and “Green” compliant
In stock
Quantity $ per unit Savings
1-9$2.480%
10-24$2.346%
25-49$2.269%
50$2.259%
Contact sales
$2.48
$2.48
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameRHLGA 2.65X3.5X1.08(MAX)MM 4L

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.The IMP23ABSU has an acoustic overload...
Read More

Key features
  • Single supply voltage operation 1.52 V - 3.6 V
  • Omnidirectional sensitivity
  • High signal-to-noise ratio
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering
  • Enhanced RF immunity
  • Ultra-flat frequency response
  • Ultrasound bandwidth (up to 80 kHz)
  • Low latency
  • Ultra-low-power: 150 µA max.
  • ECOPACK, RoHS, and “Green” compliant
Associated products