📢 Limited time offer – Buy One Get One Free on Intelligent Power Switch boards. Use code DV-IPS-BOGO-12 at checkout! Order now

Flash sale: FREE Page EEPROM products until Dec. 19th. Use code DV-EEPROM-FREE-11 at checkout! Shop Now

🎄 Celebrate early X’mas with us: $5.99 flat rate shipping on all orders! Promotion ends on Dec. 19th. Shop Now 🎄

Active

IMP23ABSUTR

Analog Bottom MEMS microphone for ultrasound applications

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameRHLGA 2.65X3.5X1.08(MAX)MM 4L

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.The IMP23ABSU has an acoustic overload...
Read More

Key features
  • Single supply voltage operation 1.52 V - 3.6 V
  • Omnidirectional sensitivity
  • High signal-to-noise ratio
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering
  • Enhanced RF immunity
  • Ultra-flat frequency response
  • Ultrasound bandwidth (up to 80 kHz)
  • Low latency
  • Ultra-low-power: 150 µA max.
  • ECOPACK, RoHS, and “Green” compliant
In stock
Quantity $ per unit Savings
1-9$2.270%
10-24$1.7821%
25-50$1.6428%
Contact sales
$2.27
$2.27
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack1
GradeIndustrial
Package NameRHLGA 2.65X3.5X1.08(MAX)MM 4L

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.The IMP23ABSU has an acoustic overload...
Read More

Key features
  • Single supply voltage operation 1.52 V - 3.6 V
  • Omnidirectional sensitivity
  • High signal-to-noise ratio
  • High acoustic overload point: 130 dBSPL typ.
  • Package compliant with reflow soldering
  • Enhanced RF immunity
  • Ultra-flat frequency response
  • Ultrasound bandwidth (up to 80 kHz)
  • Low latency
  • Ultra-low-power: 150 µA max.
  • ECOPACK, RoHS, and “Green” compliant
Associated products