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    STEVAL-STWINKT1B

    STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

    Parameters
    Operating RangeIndustrial
    Target ApplicationActive 3D glasses
    Core ProductIIS3DWB, ISM330DHCX, STSAFE-A110, IMP23ABSU, STM32L4R9ZIJ6
    ECCN US5A992.c
    ECCN EU5A002.a.2
    Packing TypeNot Applicable
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCARD
    Description

    The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.The kit features a core system board with a range of...
    Read More

    Key features
    Key features
    • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
    • Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone
    • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
    • Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
    • Micro SD Card slot for standalone data logging applications
    • On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
    • Option to implement Authentication and Brand protection secure solution with STSAFE-A110
    • Wide range of industrial IoT sensors:
      • ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
      • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
      • ultra-low-power high performance MEMS motion sensor (IIS2DH)
      • ultra-low-power 3-axis magnetometer (IIS2MDC)
      • digital absolute pressure sensor (LPS22HH)
      • low-voltage digital local temperature sensor (STTS751)
      • industrial grade digital MEMS microphone (IMP34DT05)
      • analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
    • Modular architecture, expandable via on-board connectors:
      • STMOD+ and 40-pin flex general purpose expansions
      • 12-pin male plug for connectivity expansions
      • 12-pin female plug for sensing expansions
    • Other kit components:
      • Li-Po battery 480 mAh
      • STLINK-V3MINI debugger with programming cable
      • Plastic box
    In stock
    Quantity $ per unit Savings
    1$98.000%
    1 + Contact sales
    $98.00
    $98.00
    Parameters
    Operating RangeIndustrial
    Target ApplicationActive 3D glasses
    Core ProductIIS3DWB, ISM330DHCX, STSAFE-A110, IMP23ABSU, STM32L4R9ZIJ6
    ECCN US5A992.c
    ECCN EU5A002.a.2
    Packing TypeNot Applicable
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCARD
    Description

    The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.The kit features a core system board with a range of...
    Read More

    Key features
    Key features
    • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
    • Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone
    • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
    • Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
    • Micro SD Card slot for standalone data logging applications
    • On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
    • Option to implement Authentication and Brand protection secure solution with STSAFE-A110
    • Wide range of industrial IoT sensors:
      • ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
      • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
      • ultra-low-power high performance MEMS motion sensor (IIS2DH)
      • ultra-low-power 3-axis magnetometer (IIS2MDC)
      • digital absolute pressure sensor (LPS22HH)
      • low-voltage digital local temperature sensor (STTS751)
      • industrial grade digital MEMS microphone (IMP34DT05)
      • analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
    • Modular architecture, expandable via on-board connectors:
      • STMOD+ and 40-pin flex general purpose expansions
      • 12-pin male plug for connectivity expansions
      • 12-pin female plug for sensing expansions
    • Other kit components:
      • Li-Po battery 480 mAh
      • STLINK-V3MINI debugger with programming cable
      • Plastic box
    Associated products