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Wireless Connectivity

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  1. Active

    MLPF-WB-02D3

    In Stock

    2.4 GHz Low Pass Filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages

    • 105.0
    • Ecopack2
    • -40.0
    • Chip Scale Package 0.4mm pitch
    $0.21|500u
  2. Active

    NEW

    MLPF-WL-05D3

    Coming Soon

    RF Matched filter dedicated to STM32WL3 low-power 2 Layers PCB

    • Ecopack2
    • Chip Scale Package 0.4mm pitch
    • EAR99
    • NEC
    $0.00|500u
  3. Active

    NEW

    MLPF-WL-08D3

    Coming Soon

    RF Matched filter dedicated to STM32WL3 high power 2 Layers PCB

    • 85.0
    • Ecopack2
    • -40.0
    • Chip Scale Package 0.4mm pitch
    $0.00|500u
  4. Active

    BLUENRG-234N

    In Stock

    Bluetooth® LE 5.2 Wireless Network Coprocessor

    • 105.0
    • N/A
    • -40.0
    • WLCSP MSL1
    $2.34|500u
  5. Active

    BLUENRG-345VT

    In Stock

    Programmable Bluetooth Low Energy 5.3 Wireless SoC

    • 105.0
    • N/A
    • -40.0
    • WLCSP MSL1
    $2.49|500u
  6. Active

    BLUENRG-345MC

    In Stock

    Programmable Bluetooth Low Energy 5.3 Wireless SoC

    • 85.0
    • Ecopack2
    • -40.0
    • VFQFPN 48 6x6x0.9 mm
    $2.20|500u
  7. Active

    ST60A3H1C1CCEPT3

    Out of Stock

    60 GHz V-band contactless connectivity transceiver with linear polarization integrated antenna, and

    • 85.0
    • Ecopack2
    • -20.0
    • VFBGA 23 AiP LP 2.9x4.1x0.8 mm
    $0.00|500u
  8. Active

    ST60A3H0C1CC7XY3

    Out of Stock

    60 GHz V-band contactless connectivity transceiver with eUSB2, UART, GPIO, or I2C tunneling

    • 85.0
    • Ecopack2
    • -20.0
    • VFBGA 30 2.2X2.6X0.8 P 0.4 mm
    $0.00|500u
  9. Active

    BALF-WL-00D3

    In Stock

    Balun,filtering and matching for STM32WL high power and low power in BGA package system in package

    • -40.0
    • Ecopack2
    • 105.0
    • Chip Scale Package 0.4mm pitch
    $0.51|500u