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Wireless Connectivity
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- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
- 85.0
- Ecopack2
- -40.0
- VFQFPN 48 6x6x0.9 mm
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 48 6x6x0.9 mm
-
Active
ST60A3H0C1CC7XY3
Out of Stock
60 GHz V-band contactless connectivity transceiver with eUSB2, UART, GPIO, or I2C tunneling
- 85.0
- Ecopack2
- -20.0
- VFBGA 30 2.2X2.6X0.8 P 0.4 mm
-
Active
BALFLB-WL-08D3
In Stock
balun,filtering and matching of STM32WL 17dbm 490Mhz , QFN package 4 layers pcb
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
Active
ST60A2G0C1D7GTO
Out of Stock
60 GHz V-band contactless connectivity transceiver with SLVS or GPIO tunneling
- 85.0
- Ecopack2
- -20.0
- VFBGA 25 2.2X2.2X0.8 P 0.4 mm
-
Active
MLPF-WB-02D3
In Stock
2.4 GHz Low Pass Filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack3
- -40.0
- QFN-24L
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
-
Active
BALFHB-WL-03D3
In Stock
Integrated filter matched balun to QFN STM32WL in high power mode, 862-928 MHz, using 2 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
