STM32F410CBU3

STM32F410CBU3

STM32F410CBU6

STM32F410CBU6

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STM32F410CBT6

STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 128 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator

Supply Voltage Min Volt1.7
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 48 7x7x1.4 mm

The STM32F410x8/B devices are based on the high-performance ARM®Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types....
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Key features
  • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
  • Core: ARM®32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 128 Kbytes of Flash memory
    • 512 bytes of OTP memory
    • 32 Kbytes of SRAM
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 89 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 40 μA Typ @ 25 °C; 49 μA max @25 °C
    • Stop (Flash in Deep power down mode, fast wakeup time): down to 6 μA @ 25 °C; 14 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBATsupply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 1×12-bit D/A converter
  • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
  • Up to 9 timers
    • One 16-bit advanced motor-control timer
    • One low-power timer (available in Stop mode)
    • Three 16-bit general purpose timers
    • One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
    • Two watchdog timers (independent window)
    • SysTick timer.
  • Debug mode
    • Serial wire debug (SWD) & JTAG interfaces
    • Cortex®-M4 Embedded Trace Macrocell™
  • Up to 50 I/O ports with interrupt capability
    • Up to 45 fast I/Os up to 100 MHz
    • Up to 49 5 V-tolerant I/Os
  • Up to 9 communication interfaces
    • Up to 3x I2C interfaces (SMBus/PMBus) including 1x I2C Fast-mode at 1 MHz
    • Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
    • Up to 3 SPI/I2Ss (up to 50 Mbit/s SPI or I2S audio protocol)
  • True random number generator
  • CRC calculation unit
  • 96-bit unique ID
  • RTC: subsecond accuracy, hardware calendar
  • All packages are ECOPACK®2
In stock
Quantity $ per unit Savings
1-9$3.510%
10-1499$2.5428%
1500-10000$2.1938%
Contact sales
$3.51
$3.51
Supply Voltage Min Volt1.7
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US3A991.a.2
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 48 7x7x1.4 mm

The STM32F410x8/B devices are based on the high-performance ARM®Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types....
Read More

Key features
  • Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
  • Core: ARM®32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 128 Kbytes of Flash memory
    • 512 bytes of OTP memory
    • 32 Kbytes of SRAM
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Power consumption
    • Run: 89 μA/MHz (peripheral off)
    • Stop (Flash in Stop mode, fast wakeup time): 40 μA Typ @ 25 °C; 49 μA max @25 °C
    • Stop (Flash in Deep power down mode, fast wakeup time): down to 6 μA @ 25 °C; 14 μA max @25 °C
    • Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
    • VBATsupply for RTC: 1 μA @25 °C
  • 1×12-bit, 2.4 MSPS ADC: up to 16 channels
  • 1×12-bit D/A converter
  • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
  • Up to 9 timers
    • One 16-bit advanced motor-control timer
    • One low-power timer (available in Stop mode)
    • Three 16-bit general purpose timers
    • One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
    • Two watchdog timers (independent window)
    • SysTick timer.
  • Debug mode
    • Serial wire debug (SWD) & JTAG interfaces
    • Cortex®-M4 Embedded Trace Macrocell™
  • Up to 50 I/O ports with interrupt capability
    • Up to 45 fast I/Os up to 100 MHz
    • Up to 49 5 V-tolerant I/Os
  • Up to 9 communication interfaces
    • Up to 3x I2C interfaces (SMBus/PMBus) including 1x I2C Fast-mode at 1 MHz
    • Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
    • Up to 3 SPI/I2Ss (up to 50 Mbit/s SPI or I2S audio protocol)
  • True random number generator
  • CRC calculation unit
  • 96-bit unique ID
  • RTC: subsecond accuracy, hardware calendar
  • All packages are ECOPACK®2