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Very low power application processor module for Bluetooth® low energy v5.2
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Automotive-grade silicon carbide Power MOSFET 900 V, 12 mOhm typ., 110 A in an HiP247-4 package
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High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 2MBytes of Flash memory, 1376 KB SRAM,
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High-performance and DSP with FPU, Arm Cortex-M7 MCU with 256 Kbytes of Flash memory, 216 MHz CPU, A
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Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I2C interface