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Heat Cost Allocators (HCA)
-
- 125.0
- Ecopack2
- -40.0
- DFN4 1x1
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
Active
LDK130PU10R
In Stock
300 mA low quiescent current very low noise LDO (automotive for SOT23-5L package)
- 125.0
- Ecopack2
- -40.0
- DFN6 1.2x1.3
-
Active
STM32WLE5CCU7
In Stock
Sub-GHz Wireless Microcontrollers. Arm Cortex-M4 @48 MHz with 256 Kbytes of Flash memory, 64 Kbytes
- 105.0
- Ecopack2
- -40.0
- UFQFPN 48 7x7x0.55 mm
-
Active
STM32WB55CGU6TR
In Stock
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32 MHz with 1 Mbyte of Flash memory,
- 85.0
- Ecopack2
- -40.0
- UFQFPN 48 7x7x0.55 mm
-
Active
LDK130PU12R
Out of Stock
300 mA low quiescent current very low noise LDO (automotive for SOT23-5L package)
- 125.0
- Ecopack2
- -40.0
- DFN6 1.2x1.3
-
- 125.0
- Ecopack3
- -40.0
- SOT23-5L
-
- 125.0
- Ecopack2
- -40.0
- SOT23-5L
-
Active
BLUENRG-M2SA
In Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, CHIP ANT
-
Active
LDK130PU18R
In Stock
300 mA low quiescent current very low noise LDO (automotive for SOT23-5L package)
- 125.0
- Ecopack2
- -40.0
- DFN6 1.2x1.3
