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Wireless Connectivity
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
-
- 85.0
- N/A
- -40.0
- WLCSP MSL1
-
- 105.0
- Ecopack3
- -40.0
- QFN-24L
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
-
Active
BLUENRG-M2SP
In Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, PCB ANT
-
Active
BALFHB-WL-05D3
In Stock
Integrated filter matched balun to QFN STM32WL in low power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
