STM32F411CEY6TR

High-performance access line, Arm Cortex-M4 core with DSP and FPU, 512 Kbytes of Flash memory, 100 MHz CPU, ART Accelerator

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	WLCSP 49 3x3.2x0.6 P 0.4 mm

Description

The STM32F411xC/xE devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. The Cortex®-M4 core features a floating-point unit (FPU) single precision, which supports all Arm single-precision data-processing instructions and data...
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Key features

Key features
Includes ST state-of-the-art patented technology Dynamic efficiency line with BAM (Batch acquisition mode) 1.7 V to 3.6 V power supply - 40°C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 512 Kbytes of flash memory 128 Kbytes of SRAM Clock, reset, and supply management 1.7 V to 3.6 V application supply and I/Os POR, PDR, PVD, and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 100 µA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 µA typical at 25 °C; 65 µA max at 25 °C Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA at 25 °C; 28 µA max at 25 °C Standby: 1.8 µA at 25 °C / 1.7 V without RTC; 11 µA at 85 °C at 1.7 V V_BAT supply for RTC: 1 µA at 25 °C 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer Debug mode Serial wire debug (SWD) & JTAG interfaces Cortex^Ò-M4 Embedded Trace Macrocell™ Up to 81 I/O ports with interrupt capability Up to 78 fast I/Os up to 100 MHz Up to 77 5 V-tolerant I/Os Up to 13 communication interfaces Up to 3 x I²C interfaces (SMBus/PMBus) Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI, or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I²S to achieve audio class accuracy via internal audio PLL or external clock SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK2 compliant

In stock

Quantity	$ per unit	Savings
1-9	$5.98	0%
10-24	$4.60	23%
25-99	$4.24	29%
100-249	$3.86	35%
250-499	$3.69	38%
500-999	$3.57	40%
1000-10000	$3.47	42%
10000 +	Contact sales

$5.98

Parameters

Supply Voltage Min Volt	1.7
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
Core	Arm Cortex-M4
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	WLCSP 49 3x3.2x0.6 P 0.4 mm

Description

Key features

Key features
Includes ST state-of-the-art patented technology Dynamic efficiency line with BAM (Batch acquisition mode) 1.7 V to 3.6 V power supply - 40°C to 85/105/125 °C temperature range Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 512 Kbytes of flash memory 128 Kbytes of SRAM Clock, reset, and supply management 1.7 V to 3.6 V application supply and I/Os POR, PDR, PVD, and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 100 µA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 42 µA typical at 25 °C; 65 µA max at 25 °C Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA at 25 °C; 28 µA max at 25 °C Standby: 1.8 µA at 25 °C / 1.7 V without RTC; 11 µA at 85 °C at 1.7 V V_BAT supply for RTC: 1 µA at 25 °C 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer Debug mode Serial wire debug (SWD) & JTAG interfaces Cortex^Ò-M4 Embedded Trace Macrocell™ Up to 81 I/O ports with interrupt capability Up to 78 fast I/Os up to 100 MHz Up to 77 5 V-tolerant I/Os Up to 13 communication interfaces Up to 3 x I²C interfaces (SMBus/PMBus) Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI, or I2S audio protocol), SPI2 and SPI3 with muxed full-duplex I²S to achieve audio class accuracy via internal audio PLL or external clock SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY CRC calculation unit 96-bit unique ID RTC: subsecond accuracy, hardware calendar All packages are ECOPACK2 compliant