Industrial Communication
-
- 125.0
- Ecopack2
- -40.0
- DFN4 1x1
-
Active
BLUENRG-M2SP
In Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, PCB ANT
-
- 70.0
- Ecopack2
- 0.0
- PDIP 28 .7
-
- 150.0
- Ecopack2
- -40.0
- FLIP CHIP CSPS0.45 17-20
-
Active
STM32H735IGT3
In Stock
High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz
- 125.0
- Ecopack2
- -40.0
- LQFP 176 24x24x1.4 mm
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
Active
STM32H725IGK6
In Stock
High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz
- 85.0
- Ecopack2
- -40.0
- UFBGA 176+25 10x10x0.6 P 0.65 mm
-
- 150.0
- Ecopack2
- -40.0
- SO-8
-
Active
STM32F469NIH7
In Stock
High-performance advanced line, Arm Cortex-M4 core with DSP and FPU, 2 Mbytes of Flash memory, 180 M
- 105.0
- Ecopack2
- -40.0
- TFBGA 216 13x13x1.2 P 0.8 mm
-
Active
STM32MP157CAD3T
Out of Stock
MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displ
- 125.0
- Ecopack2
- -40.0
- TFBGA 257 10x10x1.2 P 0.5 mm
