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Wireless Connectivity
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
- Ecopack2
- FLIP CHIP BUMPLESS CSPG
- EAR99
- NEC
-
Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
Active
BLUENRG-M2SP
In Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, PCB ANT
-
Active
BAL-NRF02D3
In Stock
50Ω nominal input / conjugate match balun to nRF51822-CEAA, with integrated harmonic filter
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
-
NRND
BLUENRG-MSQTR
In Stock
Bluetooth Low Energy Network Processor supporting Bluetooth 4.2 core specification
- 85.0
- Ecopack3
- -40.0
- VFQFPN32 5X5X0.9 3.6X3.6EP 0.5P
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
