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Wireless Connectivity
-
- 85.0
- N/A
- -40.0
- WLCSP MSL1
-
- 85.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
Active
BALFHB-WL-04D3
In Stock
Integrated filter matched balun to BGA STM32WL in low power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
-
Active
BALFHB-WL-01D3
In Stock
Integrated filter matched balun to BGA STM32WL in high power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
-
Active
BALF-NRF01D3
In Stock
50 Ω nominal input / conjugate match balun to nRF51822-QFAAG0,\rnRF51822-QFAB0, nRF51422-QFAAE0
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
BALF-SPI2-01D3
In Stock
50 Ω nominal input / conjugate match balun to S2-LP,868 - 930 MHz with integrated harmonic filt
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
- 105.0
- Ecopack3
- -40.0
- VFQFPN 5X5X1.0 32L WET FLK
