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Wireless Connectivity
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack2
- -40.0
- FLIP CHIP BUMPLESS CSPG
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
Active
BALFHB-WL-06D3
In Stock
Integrated filter matched balun to QFN STM32WL in low power mode, 862-928 MHz, using 2 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
BALFLB-WL-07D3
In Stock
balun,filtering and matching of STM32WL 17dbm 490Mhz , BGA package 4 layers pcb
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
Active
BALFHB-WL-01D3
In Stock
Integrated filter matched balun to BGA STM32WL in high power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
BALFHB-WL-05D3
In Stock
Integrated filter matched balun to QFN STM32WL in low power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
BALFHB-WL-02D3
In Stock
Integrated filter matched balun to QFN STM32WL in high power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- Ecopack2
- FLIP CHIP BUMPLESS CSPG
- EAR99
- NEC
