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ACEPACK 2 power module, fourpack topology, 1200 V, 13 mOhm typ. SiC Power MOSFET gen.2 with NTC
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STM32 Nucleo pack for IO-Link device applications based on L6364Q transceiver, industrial sensors an
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ACEPACK 2 power module, 3-level topology, based on silicon carbide Power MOSFETs 750 and 1200 V, 100
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NFC card reader expansion board based on ST25R100 for STM32 Nucleos
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Sub-1 GHz RF expansion board based on the SPSGRF-868 module for STM32 Nucleo
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SLLIMM nano 2nd series IPM, 3-phase inverter, 5 A, 600 V, short-circuit rugged IGBT
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SLLIMM 2nd series IPM, 3-phase inverter, 10 A, 600 V short-circuit rugged IGBTs
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Industrial digital output expansion board based on ISO808A-1 for STM32 Nucleo
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SLLIMM nano 2nd series IPM, 3-phase inverter, 5 A, 1 Ohm max., 600 V, MOSFET
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Sub-1 GHz 915 MHz RF expansion board based on S2-LP radio for STM32 Nucleo