Wireless Connectivity
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
- 85.0
- Ecopack2 (**)
- -40.0
- VFQFPN 48 6X6X0.9 MM
-
Active
BALFHB-WL-06D3
In Stock
Integrated filter matched balun to QFN STM32WL in low power mode, 862-928 MHz, using 2 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
ST60A3H0C1CC7XT4
Out of Stock
60 GHz V-band contactless connectivity transceiver with eUSB2, UART, GPIO, or I2C tunneling
- 85.0
- Ecopack2
- -20.0
- VFBGA 30 2.2X2.6X0.8 P 0.4 mm
-
Active
BALFHB-WL-04D3
In Stock
Integrated filter matched balun to BGA STM32WL in low power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
-
Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
Active
MLPF-NRG-01D3
In Stock
2.4 GHz Low Pass Filter matched to STM32WB0 series and BLUENRG-LP-LPS (BLUENRG-3x5Vx, BLUENRG-3x5Ax,
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
- 85.0
- N/A
- -40.0
- WLCSP MSL1
-
- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
