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Wireless Connectivity(77)
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Active
BALFHB-WL-04D3
In Stock
Integrated filter matched balun to BGA STM32WL in low power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
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- 85.0
- Ecopack2
- -40.0
- BLE MODULE WITH QFBLUENRG-MS
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- 85.0
- N/A
- -40.0
- WLCSP MSL1
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Active
NEW
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
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Active
BALFHB-WL-02D3
In Stock
Integrated filter matched balun to QFN STM32WL in high power mode, 862-928 MHz, using 4 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
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Active
BALFHB-WL-03D3
In Stock
Integrated filter matched balun to QFN STM32WL in high power mode, 862-928 MHz, using 2 layer PCB
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
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Active
BALFLB-WL-07D3
In Stock
balun,filtering and matching of STM32WL 17dbm 490Mhz , BGA package 4 layers pcb
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
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- Ecopack2
- VFQFPN 36 6x6x1.0 mm
- EAR99
- NEC
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Active
ST60A2G0C1D7GTO
Out of Stock
60 GHz V-band contactless connectivity transceiver with SLVS or GPIO tunneling
- 85.0
- Ecopack2
- -20.0
- VFBGA 25 2.2X2.2X0.8 P 0.4 mm
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Active
NEW
ST60A3H1C1CCEPT3
Coming Soon
60 GHz V-band contactless connectivity transceiver with linear polarization integrated antenna, and
- 85.0
- Ecopack2
- -20.0
- VFBGA 23 AiP LP 2.9x4.1x0.8 mm
