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Wireless Connectivity
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- 105.0
- Ecopack2
- -40.0
- VFQFPN 32 5x5x1.0 mm
-
Active
BALF-WL-00D3
In Stock
Balun,filtering and matching for STM32WL high power and low power in BGA package system in package
- -40.0
- Ecopack2
- 105.0
- Chip Scale Package 0.4mm pitch
-
Active
ST60A3H0C1CC7XT4
Out of Stock
60 GHz V-band contactless connectivity transceiver with eUSB2, UART, GPIO, or I2C tunneling
- 85.0
- Ecopack2
- -20.0
- VFBGA 30 2.2X2.6X0.8 P 0.4 mm
-
Active
BALF-NRF01E3
In Stock
50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and
- Ecopack2
- FLIP CHIP BUMPLESS CSPG
- EAR99
- NEC
-
- 105.0
- N/A
- -40.0
- WLCSP MSL1
-
Active
MLPF-WB-02D3
In Stock
2.4 GHz Low Pass Filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages
- 105.0
- Ecopack2
- -40.0
- Chip Scale Package 0.4mm pitch
-
Active
BLUENRG-M2SA
In Stock
Very low power application processor module for Bluetooth® low energy v5.2
- 85.0
- Ecopack2
- -40.0
- BLUENRG-2 MODULE QFN, CHIP ANT
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- Ecopack2
- FLIP CHIP BUMPLESS CSPG
- EAR99
- NEC
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
-
- Ecopack2
- Chip Scale Package 0.4mm pitch
- EAR99
- NEC
