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ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET
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Mainstream Arm Cortex-M0+ MCU with 128 Kbytes of Flash memory, 36 Kbytes RAM, 64 MHz CPU, 4x USART,
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N-channel 650 V, 0.073 Ohm typ., 30 A MDmesh M5 Power MOSFET in D2PAK package
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Silicon carbide Power MOSFET 1200 V, 62 mOhm typ., 36 A in an HiP247 package
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Ultra-low-power with FPU Arm Cortex-M33 MCU with TrustZone, 160 MHz with 512 Kbytes of Flash memory
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Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32 MHz with 1 Mbyte of Flash memory,
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Sub-GHz Wireless Microcontrollers. Dual-core Arm Cortex-M4/M0+ @48 MHz with 256 Kbytes of Flash memo
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Silicon carbide Power MOSFET 650 V, 20 mOhm typ., 55 A in an H2PAK-7 package